1. Electrical reliability engineering design technology of switching power supply

2. Electromagnetic compatibility (EMC) design technology

3. COSEL switching power supply heat dissipation design technology
Statistics show that when the temperature rises by 2 degree , the reliability of electronic components decreases 10 times; the lifespan when the temperature rises by 50 degree is only 1/6 of the life when the temperature rises by 25 degree . In addition to electrical stress, temperature is also an important factor affecting equipment reliability. This requires technical measures to limit the temperature rise of the chassis and components, which is the thermal design. The principle of thermal design is to reduce heat generation, that is, to choose better control methods and technologies, such as phase shift control technology, synchronous rectification technology, etc.; the other is to choose low-power devices, reduce the increase in the number of heating devices, and thick wires The width increases the efficiency of the power supply. The second is to enhance heat dissipation, that is, using conduction, radiation and convection technologies for heat transfer. This includes radiator design, air cooling (natural convection and forced air cooling) design, liquid cooling (water, oil) design, thermoelectric cooling design, heat pipe design, etc. Forced air cooling can dissipate more than ten times the heat of a radiator. Use natural cooling, but fans, fan power supplies, interlocking devices, etc. should be added, and the heat dissipation method should be selected based on the actual design conditions.